International Relations and R&D Management Office is pleased to call for International University students’ application for the scholarships offered by the Catholic University of America (CUA), USA.

CUA is located in northeast Washington, D.C., which attracts some of the world’s most interesting people. The university has a campus of 193 acres (largest in the USA capital city), where 3,000 undergraduate and 3,100 graduate students from approximately 90 countries are studying. 96% of its faculty holds the highest degree in field.

In AY 2008 – 2009, the university is offering 10 scholarships for International University students who are studying in the 2 schools: Computer Science & Engineering, and Electrical Engineering. Each scholarship covers 50% of the tuition for 5-semester studies in CUA. After completing the course, students will be awarded the degree by the Catholic University of America. The application fee of 45USD/student will be paid by Prof. Charles Nguyen, the Dean of CUA School of Engineering.

With the scholarships provided, the tuition and cost of living (per year) that students have to cover by themselves is estimated as follows:

So far there have been 4 students granted the scholarships and currently studying at CUA, including 3 students transferring last academic year and 1 going to the university in August 2008 to enter Semester 1 AY 2008 – 2009.

Interested students may apply for the scholarship to study at CUA from Semester 2 AY 2008 – 2009 (which starts in January 2009).

Requirements:

• Eligible applicants are students who have completed at least 5 semesters at IU.
• The English requirement is TOEFL 450 – 500 (or equivalent).
• Admitted students must provide written proof that they have adequate funds to meet the expenses incurred while studying in the US (for visa application).

http://admissions.cua.edu/transfer/

• Official transcripts;
• English proficiency certificate;
• An essay outlining your interest in CUA, your past academic achievements, and your goal as you apply for transfer;
• A letter of recommendation;
• Financial documents.

All application materials should be submitted to the Office of International Relations and R&D Management by 7 November, 2008.

For more information, pls. visit website: www.cua.edu, or contact

• Mr. Nguyen Dinh Uyen, PhD, School of Electrical Engineering
  (email: nduyen@hcmiu.edu.vn)
• Ms. Lan Anh, Office of International Relations and R&D Management
  (Tel: 7242181, ext. 3355; e-mail: lnlanh@hcmiu.edu.vn)